Custom Packaging Solutions | Metallized Substrates, Packages & Components
Lumileds talks LED packaging - interview
Schematic of a deep UV LED heterostructure flip-chip mounted onto a... | Download Scientific Diagram
Submounts and Subcarriers | Components for Fiber-Optic Communication Modules | Ceramic Packages | Products | KYOCERA
Laser & Photo Diode Submounts | Thick & Thin Metallization | Plated Copper
Ceramic Packages for Light Emitting Diodes (LEDs) | Ceramic Packages | Products | KYOCERA
Through-Silicon via Submount for Flip-Chip LEDs
OSA | A novel integrated structure of thin film GaN LED with ultra-low thermal resistance
Cross section of a flip-chip LED | Download Scientific Diagram
OSLON® Submount CL, KW C3L5L1.TE | OSRAM Opto Semiconductors
AN033_Processing of LEDs - Information on the multi-chip ceramic OSLON Submount CL LEDs.fm
Thermal management of high-power LEDs - Wikipedia
led-substrates-and-submounts - Remtec
What Does LED Stands for?
Pushing the boundaries of UV LED power
Human-centric lighting placing greater demands on LED... Smart2.0
ZEISS Microscopy Online Campus | Light-Emitting Diodes
CMD-LuxGuard: ESD Protection for UHB LEDs — LED professional - LED Lighting Technology, Application Magazine
nanoplus | Mid-Infrared LEDs: 4000 nm - 5300 nm
US20130248913A1 - Highly reflective coating on led submount - Google Patents
3D LED and IC wafer level packaging | Emerald Insight
Analysis of electrical parameters of InGaN-based LED packages with aging - ScienceDirect
Submounts and Subcarriers | Components for Fiber-Optic Communication Modules | Ceramic Packages | Products | KYOCERA
Research status and prospects of deep ultraviolet devices
